Multilayers PCBs
Double-sided PCBs
 
Construction
» Standard copper-claddings: 18µm, 35µm, 70µm,105 µm
Base Material
» FR-4-Standard, HTG Materials, FR4 CTI 400
PCB Thickness
» Standard from 0.8 to 2.4 mm
Solder Surface
» Organic copper-passivation (ENTEK)
» Hot air levelling (HAL)
» Electroless nickel/gold (NiAu)
» Chemical tin
Solder Mask
» 2-component solder mask
» Photosensitive solder mask
Special Printing
» Via hole plugging ink
» Electrical conductive ink (carbon)
» Legend print
» Peelable solder mask
Line Width / Distance
» Standard = 120 µm
Drilldiameter
» Drilldiameter = 0,3 mm
Routing
» Milled
» Scored (continuous or discontinuous)
Data Input Types

» High level data: ODB++
» Film plot data (Gerber, HPGL)
» NC drilling data (Excellon, Sieb & Meyer, etc.)
» Drawing Data (HPGL, DXF, TIFF, etc.)
Transmission
» Email: technique@fubatunisie.com
Production Tool Preparation
» CAM-systems for preparation of films, etc., with design-rule check
(UCAM from Mania Barco)
» Plotting of layouts on 2000 /10000 dpi high definition plotter
Test Equipment
» Automatic-Optical-Inspection
» 100% electrical function test
» Visual inspection
Quality Check
» Process improvement tools SPC, FEMA, 8D, PDCA, DOE
» Guarantee of customer-specific quality standards production
according to international standards:
IPC-A600, DIN IEC 326, UL-Approbation
  
Top of the page